| Processor socket | LGA 3647 (Socket P) |
|---|---|
| Processor cores | 16 |
| Processor family | Intel Xeon Gold |
| Processor lithography | 14 nm |
| SKU | UCS-CPU-I5218B |
| Manufacturer | Cisco |
| Availability | In Stock |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.3 GHz |
| Processor manufacturer | Intel |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 125 W |
| Processor cache | 22 MB |
| Processor model | 5218B |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.9 GHz |
| Bus type | UPI |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 125 W |
| Technical details | |
|---|---|
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | 4S |
| Thermal Design Power (TDP) | 125 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 125 W |
| Processor package size | 76 x 56.5 mm |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | 4S |
| Market segment | Server |
| Processor special features | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Operational conditions | |
| Tcase | 87 °C |
| Weight & dimensions | |
| Processor package size | 76 x 56.5 mm |
| Product |
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|---|---|---|---|---|---|---|
| SKU |
UCS-CPU-I5218B
|
100-100000031BOX
|
YD3400C5FHBOX
|
YD3200C5FHBOX
|
YD3200C5M4MFH
|
CM8071504651013
|
| Manufacturer |
Cisco
|
AMD
|
AMD
|
AMD
|
AMD
|
Intel
|
| Processor lithography |
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
N/A
|
| Processor family |
Intel Xeon Gold
|
AMD Ryzen 5
|
AMD Ryzen 5
|
AMD Ryzen 3
|
AMD Ryzen 3
|
Intel Core i3
|
| Processor socket |
LGA 3647 (Socket P)
|
Socket AM4
|
Socket AM4
|
Socket AM4
|
Socket AM4
|
LGA 1700
|
| Processor cores |
16
|
6
|
4
|
4
|
4
|
4
|
| On-board graphics adapter |
N
|
N
|
Y
|
Y
|
Y
|
N
|
| Discrete graphics adapter |
N
|
N
|
N
|
N
|
N
|
N
|
| Cooler included |
N/A
|
Y
|
Y
|
Y
|
N
|
N/A
|
| Package type |
N/A
|
Box
|
Box
|
Box
|
Tray
|
Tray
|
