| Processor socket | LGA 3647 (Socket P) |
|---|---|
| Box | No |
| Processor cores | 10 |
| Processor family | Intel Xeon Silver |
| SKU | P19791-B21B |
| Manufacturer | HPE |
| Availability | In Stock |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
|---|---|
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Packaging data | |
| Package type | Tray |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
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|---|---|---|---|---|---|---|
| SKU |
P19791-B21B
|
CM8064601560113
|
S26361-F3828-L240
|
100-000000041
|
100-000000078
|
100-000000054
|
| Manufacturer |
HPE
|
Intel
|
Fujitsu
|
AMD
|
AMD
|
AMD
|
| Processor lithography |
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
| Processor family |
Intel Xeon Silver
|
Intel Core i7
|
Intel Xeon E5 v2
|
AMD EPYC
|
AMD EPYC
|
AMD EPYC
|
| Processor socket |
LGA 3647 (Socket P)
|
LGA 1150 (Socket H3)
|
LGA 1356 (Socket B2)
|
Socket SP3
|
Socket SP3
|
Socket SP3
|
| Processor cores |
10
|
4
|
4
|
8
|
16
|
32
|
| On-board graphics adapter |
N
|
Y
|
N
|
N
|
N
|
N
|
| Discrete graphics adapter |
N
|
N/A
|
N/A
|
N
|
N
|
N
|
| Cooler included |
N
|
N
|
N/A
|
N
|
N
|
N
|
| Package type |
Tray
|
Tray
|
N/A
|
Tray
|
Tray
|
Tray
|
