The store will not work correctly when cookies are disabled.
JavaScript seems to be disabled in your browser.
For the best experience on our site, be sure to turn on Javascript in your browser.
Lenovo Intel Xeon Gold 5220R processor 2.2 GHz 35.75 MB L3 Tray
Overview
Intel Xeon Gold 5220R Processor 35.75M Cache, 2.20 GHz, Processor Option Kit SR650, Ref
More Information
SKU
4XG7A37974B
Manufacturer
Lenovo
Availability
In Stock
ThinkSystem servers incorporate Intel Xeon Scalable Family processors to enable critical business workloads and applications. The Intel scalable design provides significant improvement in performance, advanced reliability, scalability and hardware-enhanced security. Enhancements include higher per-core performance, greater memory bandwidth, expanded I/O, and improved security. This page allows you compare the features of the processors.
Processor Processor generation 2nd Generation Intel® Xeon® Scalable Processor base frequency 2.2 GHz Processor manufacturer Intel Cooler included No Processor codename Cascade Lake Thermal Design Power (TDP) 150 W Processor cache 35.75 MB Processor model 5220R Processor threads 48 System bus rate 10.4 GT/s Processor operating modes 64-bit Processor boost frequency 4 GHz Component for Server/workstation Processor lithography 14 nm Processor family Intel® Xeon® Gold Processor cores 24 Processor socket LGA 3647 (Socket P) Processor series Intel Xeon Gold 5000 Series Processor cache type L3 Package type Tray Memory Maximum internal memory supported by processor 1 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2667 MHz Memory channels Hexa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 150 W
Technical details PCI Express slots version 3.0 Scalability 2S Thermal Design Power (TDP) 150 W Processor series Intel Xeon Gold 5000 Series Market segment Server Processor cache type L3 Features Maximum number of PCI Express lanes 48 Thermal Design Power (TDP) 150 W PCI Express slots version 3.0 Scalability 2S Market segment Server Harmonized System (HS) code 85423119 Packaging data Package type Tray Logistics data Harmonized System (HS) code 85423119
Search engine powered by ElasticSuite
