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Lenovo Intel Xeon Gold 6240 processor 2.6 GHz 24.75 MB
Overview
ThinkSystem SR570/SR630 Intel Xeon Gold 6240 18C 150W 2.6GHz Processor Option Kit w/o FAN, Ref
More Information
SKU
4XG7A37884B
Manufacturer
Lenovo
Availability
In Stock
ThinkSystem servers incorporate Intel Xeon Scalable Family processors to enable critical business workloads and applications. The Intel scalable design provides significant improvement in performance, advanced reliability, scalability and hardware-enhanced security. Enhancements include higher per-core performance, greater memory bandwidth, expanded I/O, and improved security. This page allows you compare the features of the processors.
Processor Processor generation 2nd Generation Intel® Xeon® Scalable Processor base frequency 2.6 GHz Processor manufacturer Intel Cooler included No Processor codename Cascade Lake Thermal Design Power (TDP) 150 W Processor cache 24.75 MB Processor ARK ID 192443 Processor model 6240 Processor threads 36 Processor operating modes 64-bit Processor boost frequency 3.9 GHz Component for Server/workstation Processor lithography 14 nm Processor family Intel® Xeon® Gold Processor cores 18 Processor socket LGA 3647 (Socket P) Memory Maximum internal memory supported by processor 1 TB Memory types supported by processor DDR4-SDRAM Memory clock speeds supported by processor 2933 MHz Supported memory types DDR4-SDRAM Memory channels Hexa-channel ECC Yes Graphics Discrete graphics card No On-board graphics card model Not available On-board graphics card No Discrete graphics card model Not available Power Thermal Design Power (TDP) 150 W Technical details Intel TSX-NI Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes PCI Express slots version 3.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 4S Intel VT-x with Extended Page Tables (EPT) Yes Embedded options available No Product type Processor Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 150 W Supported memory types DDR4-SDRAM Status Launched Market segment Server Launch date Q2'19 Intel Virtualization Technology (VT-x) Yes Number of UPI links 3 Memory speed (max) 2933 MHz AVX-512 Fused Multiply-Add (FMA) units 2 Features Maximum number of PCI Express lanes 48 Thermal Design Power (TDP) 150 W Processor package size 76mm x 56.5mm Processor ARK ID 192443 Execute Disable Bit Yes PCI Express slots version 3.0 Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512 Scalability 4S Embedded options available No Market segment Server Harmonized System (HS) code 85423119 Export Control Classification Number (ECCN) 5A992C Commodity Classification Automated Tracking System (CCATS) G077159 PCI Express CEM revision 3.0
Processor special features Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Intel Turbo Boost Max Technology 3.0 No Intel® Speed Shift Technology Yes Intel TSX-NI Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Enhanced Intel SpeedStep Technology Yes Intel VT-x with Extended Page Tables (EPT) Yes Intel Virtualization Technology (VT-x) Yes AVX-512 Fused Multiply-Add (FMA) units 2 Intel® Volume Management Device (VMD) Yes Intel® Speed Select technology - Performance Profile (Intel® SST-PP) No Intel® Optane™ DC Persistent Memory Supported Yes Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes Mode-based Execute Control (MBE) Yes Intel® Run Sure Technology Yes Intel® Resource Director Technology (Intel® RDT) Yes Intel® vPro™ Platform Eligibility Yes Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) No Intel® Optane™ DC Persistent Memory technology Yes Intel Speed Select Technology (SST) No Intel® Transactional Synchronization Extensions Yes Operational conditions Tcase 85 °C Packaging data Package width 43 mm Package depth 137 mm Package height 112 mm Package weight 201 g Logistics data Harmonized System (HS) code 85423119 Weight & dimensions Processor package size 76mm x 56.5mm Package width 43 mm Package depth 137 mm Package height 112 mm Package weight 201 g Other features Maximum internal memory 1 TB
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